Diamond Back Grinding Wheel

The Diamond Back Grinding Wheel is a tool specifically designed for semiconductor manufacturing and other precision machining fields, primarily used for wafer thinning and backside grinding.If you need it, you can click below to contact us!

Description

Diamond Back Grinding Wheel is widely used in semiconductor manufacturing, especially in the back-end processing stage of wafers, to optimize wafer thickness through backside grinding to meet different packaging and integration requirements.During the grinding process on the backside of the wafer, the Diamond Back Grinding Wheel generates frictional force through rotation to bring the diamond abrasive into contact with the backside of the wafer, thereby removing the material on the backside of the wafer.

In addition to the semiconductor manufacturing field, Diamond Back Grinding Wheel can also be used in other applications that require high-precision and high-efficiency grinding, such as the processing of optical components, precision ceramics, hard alloys and other materials.

Specification

The current specifications of Jincheng are diamond back grinding wheels with diameters of 255 and 380, and the bonding agent used is metal. If you need it, we can also customize production for you based on your application scenario and the drawings and parameters you provide. Of course, you can choose other types of binders, such as resin binders and ceramic binders.

Advantage

1. High precision

Diamond, as an abrasive, has extremely high hardness and wear resistance, ensuring high precision and consistency in the grinding process.

2. High efficiency

The diamond grinding wheel has high grinding efficiency and can quickly remove the material on the back of the wafer, shortening the production cycle.

3. Long lifespan

Due to the wear resistance of diamond, the service life of Diamond Back Grinding Wheel is relatively long, reducing production costs.

4. Strong adaptability

Jincheng can choose diamond abrasives with different particle sizes, hardness, and shapes according to different grinding needs to meet customers' diverse processing needs.

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